A field device apparatus includes a field device that includes a first PCB (Printed Circuit Board) based on a PCB outline of a PWA (Printed Wiring Assembly) and a second PCB based on the PCB outline. One or more pass-through-hole standoffs can be configured with respect to the first and second PCB's in a configuration, wherein the PCB outline is extended to mount the pass-through-hole standoff to the first PCB and the second PCB. The pass-through-hole standoff can be soldered to the first PCB which is connected to a chassis ground that allows a mounting screw to make contact from a top side of the field device to a field mount housing through the pass-through-hole standoff, thereby effectively providing chassis ground connection through mounting screws to the external world. The pass-through-hole standoff can include a through-hole, but does not contain a thread therein.