Invention Grant
- Patent Title: Seed sensor with lightpipe photodetect assembly
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Application No.: US14424131Application Date: 2013-08-27
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Publication No.: US09913425B2Publication Date: 2018-03-13
- Inventor: Ronald W. Steffen , Dahu Qi , Gregry C. Miller
- Applicant: DICKEY-john Corporation
- Applicant Address: US MN St. Paul
- Assignee: TSI, Incorporated
- Current Assignee: TSI, Incorporated
- Current Assignee Address: US MN St. Paul
- Agency: Kagan Binder, PLLC
- International Application: PCT/US2013/056772 WO 20130827
- International Announcement: WO2014/035949 WO 20140306
- Main IPC: A01C7/10
- IPC: A01C7/10 ; A01C7/20 ; G01B11/14

Abstract:
In one example embodiment, a seed sensor is disclosed adapted to fit a conventional mounting location in existing seed tubes that provides improved performance by providing a wide light source (more LEDS), a wide photodetector and a current profiling scheme for the LEDs that provides more light at the opposite ends of the LED array. A result of such an arrangement is to improve seed resolution and to reduce seed spatial variability within the seed tube.
Public/Granted literature
- US20160374263A1 SEED SENSOR WITH LIGHTPIPE PHOTODETECT ASSEMBLY Public/Granted day:2016-12-29
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