A method for transient liquid phase bonding two metallic substrate segments together including the steps of forming a joined component by bringing together the two substrate segments along a bond line with a brazing alloy comprising a melting point depressant disposed between the two segments at the bond line and performing a first thermal treatment including heating the joined component at a brazing temperature of the brazing alloy for a first period of time. The method further includes performing a second thermal treatment including heating the joined component at an intermediate temperature that is above the brazing temperature but below a gamma prime solvus temperature of the substrate segments for a second period of time and performing a third thermal treatment including heating the joined component at a super-solvus temperature that is above the gamma prime solvus temperature of the two metallic substrate segments for a third period of time.