A microcapsule-type curable resin composition enables the mass production of microcapsules each encapsulating a curing agent and therefore can be produced at significantly low cost, and which has an excellent adhesion property and excellent storage stability. Particularly, a microcapsule-type curable resin composition can exhibit excellent low-temperature curability and an excellent curing rate when used for a screw member such as a screw and can exhibit a significantly superior effect when used for preventing the looseness of screws. A microcapsule-type curable resin composition includes microcapsules each encapsulating (a) a compound having at least three thiol groups; (b) a substance capable of being cured by reacting with the compound having at least three thiol groups; and (c) a binder capable of adhering the microcapsules to a material of interest. The curable resin composition can be used preferably for the adhesion of a screw member.