A force sensing compliant enclosure for an electronic device may include at least one deformable housing wall. At least one strain concentration portion may be located on the deformable housing wall where strain caused by application of a force that deforms the deformable housing wall is greater than at other portions of the deformable housing wall. The strain concentrating portion may have a second thickness that is thinner than other portions of the deformable housing wall. One or more sensors may be positioned in the strain concentration portion and may sense strain caused by the application of the force that deforms the deformable housing wall.