Invention Grant
- Patent Title: Data acquisition method of substrate processing apparatus and sensing substrate
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Application No.: US13537637Application Date: 2012-06-29
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Publication No.: US09915677B2Publication Date: 2018-03-13
- Inventor: Hikaru Akada
- Applicant: Hikaru Akada
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Annie Kock
- Priority: JP2011-147582 20110701
- Main IPC: G01P5/12
- IPC: G01P5/12 ; G01P13/04

Abstract:
A data acquisition method of a substrate processing apparatus for acquiring data on gas current directions in a plurality of measurement regions on a surface of a substrate, includes: loading a sensing substrate having a plurality of pairs of sensors on a loader, wherein each pair of sensors includes a first sensor and a second sensor configured to acquire vector data of the gas current on the surface of the sensing substrate; acquiring vector data of the gas current in a first linear direction by the first sensor; acquiring vector data of the gas current in a second linear direction slanted to the first linear direction by the second sensor; and combining the gas current vectors based on a starting point associated with the respective pair of sensors; and calculating a gas current direction from the starting point associated with the respective pair of sensors.
Public/Granted literature
- US20130006547A1 DATA ACQUISITION METHOD OF SUBSTRATE PROCESSING APPARATUS AND SENSING SUBSTRATE Public/Granted day:2013-01-03
Information query
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