Invention Grant
- Patent Title: Pattern forming method, composition kit and resist film, and method for producing electronic device using them, and electronic device
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Application No.: US14854035Application Date: 2015-09-14
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Publication No.: US09915870B2Publication Date: 2018-03-13
- Inventor: Hiroo Takizawa , Kaoru Iwato
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2013-053055 20130315
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/11 ; C08F212/14 ; C08F12/24 ; C08F12/30 ; G03F7/20 ; G03F7/32 ; G03F7/039 ; C08F20/28 ; C08F12/20
Abstract:
There is provided a pattern forming method comprising (a) a step of forming a film on a substrate using an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition, (b) a step of forming a top coat layer on the film using a top coat composition containing a resin (T) containing at least any one of repeating units represented by formulae (I-1) to (I-5) shown below, (c) a step of exposing the film having the top coat layer using an electron beam or an extreme ultraviolet radiation, and (d) a step of developing the film having the top coat layer after the exposure to form a pattern.
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Information query
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