Invention Grant
- Patent Title: Method for detecting a thinning of the semiconductor substrate of an integrated circuit from its back face and corresponding integrated circuit
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Application No.: US15218261Application Date: 2016-07-25
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Publication No.: US09916902B2Publication Date: 2018-03-13
- Inventor: Pascal Fornara , Christian Rivero
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1651424 20160222
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L27/115 ; H01L21/82 ; H01L29/78 ; G11C16/22 ; H01L21/311 ; H01L21/8238 ; H01L21/8234 ; H01L21/74 ; H01L21/66
Abstract:
The thinning of a semiconductor substrate of an integrated circuit from a back face is detected using the measurement of a physical quantity representative of the resistance between the ends of two electrically-conducting contacts situated at an interface between an insulating region and an underlying substrate region. The two electrically-conducting contacts extend through the insulating region to reach the underlying substrate region.
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