A method of manufacturing a multilayer electronic component comprises steps of: preparing first insulating sheets having internal electrode patterns formed thereon; moving one or more of the first insulating sheets having the internal electrode patterns formed thereon onto a lower mold; arranging a second insulating sheet to be disposed between an internal electrode pattern disposed in an uppermost position among the internal electrode patterns formed on the lower mold and an upper mold and pressing the first insulating sheets having the internal electrode patterns formed thereon by the upper mold to form a laminate; and sintering the laminate to form a multilayer body. In a cross section in a width-thickness direction of the internal electrode pattern included in the multilayer body, 0.45≦t2/t2≦1.0, where t1 is a thickness of one side of the internal electrode pattern in relation to a central line connecting both vertices of the internal electrode pattern in a width direction and t2 is a thickness of the other side of the internal electrode pattern in relation to the central line and t2 is larger than or equal to t1.