Invention Grant
- Patent Title: Semiconductor device, and method for assembling semiconductor device
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Application No.: US14878539Application Date: 2015-10-08
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Publication No.: US09917031B2Publication Date: 2018-03-13
- Inventor: Shin Soyano
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agent Manabu Kanesaka
- Priority: JP2013-203390 20130930; JP2013-224234 20131029
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/498 ; H01L21/52 ; H01L23/36 ; H01L25/07 ; H01L25/18 ; H01L23/24 ; H01L23/373 ; H01L23/495 ; H01L23/00
Abstract:
A semiconductor device includes an insulating substrate; a semiconductor element mounted on the insulating substrate; and a radiation block bonded to the semiconductor element. The radiation block includes a three-dimensional radiation portion and a base portion connected to the radiation portion. The radiation portion of the radiation block has a pin shape, a fin shape, or a porous shape.
Public/Granted literature
Information query
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