Invention Grant
- Patent Title: Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices
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Application No.: US14213774Application Date: 2014-03-14
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Publication No.: US09917068B2Publication Date: 2018-03-13
- Inventor: Hao-Cheng Hou , Yu-Feng Chen , Jung Wei Cheng , Yu-Min Liang , Tsung-Ding Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00 ; H01L23/498 ; H01L23/13 ; H05K3/34
Abstract:
In some embodiments, a package substrate for a semiconductor device includes a substrate core and a material layer disposed over the substrate core. The package substrate includes a spot-faced aperture disposed in the substrate core and the material layer.
Public/Granted literature
- US20150262956A1 Package Substrates, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices Public/Granted day:2015-09-17
Information query
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