Invention Grant
- Patent Title: LED package
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Application No.: US15370837Application Date: 2016-12-06
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Publication No.: US09917076B2Publication Date: 2018-03-13
- Inventor: Jong Uk An , Noh Joon Park
- Applicant: ALLIX CO., LTD.
- Applicant Address: KR Jeonju, Jeollabuk-Do
- Assignee: ALLIX CO., LTD.
- Current Assignee: ALLIX CO., LTD.
- Current Assignee Address: KR Jeonju, Jeollabuk-Do
- Agency: Pearl Cohen Zedek Latzer Baratz LLP
- Priority: KR10-2016-0075012 20160616; KR10-2016-0147969 20161108
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L25/075 ; H01L33/54 ; H01L33/50 ; H01L33/64
Abstract:
An LED package having a plurality of light emitting regions includes a plurality of LED chips. The LED package further includes a plurality of electrode portions on which each of the plurality of LED chips is mounted, and a package mold portion having a plurality of openings formed on one surface thereof so as to each emit light by the plurality of LED chips.
Public/Granted literature
- US20170365585A1 LED PACKAGE Public/Granted day:2017-12-21
Information query
IPC分类:
