Invention Grant
- Patent Title: Semiconductor device including finFET and fin varactor
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Application No.: US15181676Application Date: 2016-06-14
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Publication No.: US09917081B2Publication Date: 2018-03-13
- Inventor: Kangguo Cheng , Junli Wang , Ruilong Xie , Tenko Yamashita
- Applicant: International Business Machines Corporation , GlobalFoundries, Inc.
- Applicant Address: KY Grand Cayman US NY Armonk
- Assignee: GLOBALFOUNDRIES, INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: GLOBALFOUNDRIES, INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: KY Grand Cayman US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L27/06 ; H01L29/78 ; H01L29/93 ; H01L29/10

Abstract:
A semiconductor device includes a semiconductor substrate having a fin-type field effect transistor (finFET) on a first region and a fin varactor on a second region. The finFET includes a first semiconductor fin that extends from an upper finFET surface thereof to the upper surface of the first region to define a first total fin height. The fin varactor includes a second semiconductor fin that extends from an upper varactor surface thereof to the upper surface of the second region to define a second total fin height that is different from the first total fin height of the finFET.
Public/Granted literature
- US20170154883A1 SEMICONDUCTOR DEVICE INCLUDING FINFET AND FIN VARACTOR Public/Granted day:2017-06-01
Information query
IPC分类: