Invention Grant
- Patent Title: Semiconductor device with an upper surface of a substrate at different levels and method of manufacturing the same
-
Application No.: US13858142Application Date: 2013-04-08
-
Publication No.: US09917083B2Publication Date: 2018-03-13
- Inventor: Satoshi Kura , Mitsuo Nissa , Keiji Sakamoto , Taichi Iwasaki
- Applicant: Renesas Electronics Corporation
- Applicant Address: unknown Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: unknown Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2012-096641 20120420
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L27/108 ; H01L49/02

Abstract:
A first transistor required for decreasing leak current and a second transistor required for compatibility of high speed operation and low power consumption can be formed over an identical substrate and sufficient performance can be provided to the two types of the transistors respectively. Decrease in the leak current is required for the first transistor. Less power consumption and high speed operation are required for the second transistor. The upper surface of a portion of a substrate in which the second diffusion layer is formed is lower than the upper surface of a portion of the substrate where the first diffusion layer is formed.
Public/Granted literature
- US20130277749A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-10-24
Information query
IPC分类: