Invention Grant
- Patent Title: Semiconductor device and a method for fabricating the same
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Application No.: US15090202Application Date: 2016-04-04
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Publication No.: US09917084B2Publication Date: 2018-03-13
- Inventor: Fang Chen , Jhon Jhy Liaw , Min-Chang Liang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L27/088 ; H01L21/8234 ; H01L29/51 ; H01L29/49

Abstract:
A semiconductor device includes a fin field effect transistor. The semiconductor device includes a first gate electrode, a first source/drain (S/D) region disposed adjacent to the first gate electrode, a first S/D contact disposed on the first S/D region, a first spacer layer disposed between the first gate electrode and the first S/D region, a first contact layer in contact with the first gate electrode and the first S/D contact, and a first wiring layer integrally formed with the first contact layer. There is no interface between the first contact layer and the first wiring layer in a cross sectional view, and the first contact layer has a smaller area than the first wiring layer in plan view.
Public/Granted literature
- US09947657B2 Semiconductor device and a method for fabricating the same Public/Granted day:2018-04-17
Information query
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