Invention Grant
- Patent Title: Metal gate isolation structure and method forming same
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Application No.: US15225304Application Date: 2016-08-01
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Publication No.: US09917085B2Publication Date: 2018-03-13
- Inventor: Chih-Han Lin , Wen-Shuo Hsieh , Ming-Jie Huang , Ryan Chia-Jen Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/78 ; H01L27/088 ; H01L21/782 ; H01L29/66 ; H01L21/8234 ; H01L29/06 ; H01L27/11 ; H01L21/8238

Abstract:
A device includes a gate isolation plug, which further includes a U-shaped layer having a bottom portion and two sidewall portions, and an inner region overlapping the bottom portion. The inner region contacts the two sidewall portions. A first transistor has a first gate stack, and a first end of the first gate stack is in contact with both the inner region and the U-shaped layer of the gate isolation plug. A second transistor has a second gate stack, and a second end of the second gate stack is in contact with both the inner region and the U-shaped layer of the gate isolation plug. The first gate stack and the second gate stack are on opposite sides of the gate isolation plug.
Public/Granted literature
- US20170345820A1 Metal Gate Isolation Structure and Method Forming Same Public/Granted day:2017-11-30
Information query
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