Invention Grant
- Patent Title: Semiconductor device
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Application No.: US14819068Application Date: 2015-08-05
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Publication No.: US09917183B2Publication Date: 2018-03-13
- Inventor: Masatoshi Arai , Yoshitaka Hokomoto , Tatsuya Nishiwaki
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2015-046471 20150309
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L29/78 ; H01L29/40 ; H01L29/66 ; H01L29/417

Abstract:
A semiconductor device is provided including a first electrode and a first semiconductor layer of a first conductivity type connected to the first electrode. The semiconductor device further includes a second semiconductor layer of a second conductivity type provided on the first semiconductor layer, a third semiconductor layer of the first conductivity type provided on the second semiconductor layer, and a second electrode provided on the third semiconductor layer. The semiconductor device further includes a third electrode disposed between the first electrode and the second electrode. The semiconductor device further includes a fourth electrode having an upper end connected to the second electrode, where the fourth electrode has a higher resistivity than the second electrode.
Public/Granted literature
- US20160268420A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-09-15
Information query
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