Invention Grant
- Patent Title: Semiconductor component that includes a clamping structure and method of manufacturing the semiconductor component
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Application No.: US15209578Application Date: 2016-07-13
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Publication No.: US09917184B2Publication Date: 2018-03-13
- Inventor: Prasad Venkatraman , Balaji Padmanabhan
- Applicant: Semiconductor Components Industries, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Rennie William Dover
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L31/062 ; H01L27/01 ; H01L29/78 ; H01L29/66 ; H01L29/10 ; H01L27/088 ; H01L29/423 ; H01L29/06 ; H01L29/40
Abstract:
Embodiments include a method and structure to that provide a clamping structure in an integrated semiconductor device. In accordance with an embodiment, the method includes forming trenches in a semiconductor material and forming a shield electrode in a portion of at least one of the trenches. A clamping structure is formed adjacent to a trench. The clamping structure has an electrode that may be electrically connected to a source region of the integrated semiconductor device. In accordance with another embodiment, an impedance element is formed in a trench.
Public/Granted literature
Information query
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