- Patent Title: Thermoelectric element and thermoelectric module provided with same
-
Application No.: US14371880Application Date: 2012-12-10
-
Publication No.: US09917238B2Publication Date: 2018-03-13
- Inventor: Mitsuoki Konnai , Akio Konishi
- Applicant: KELK Ltd.
- Applicant Address: JP Kanagawa
- Assignee: KELK LTD.
- Current Assignee: KELK LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Global IP Counselors, LLP
- Priority: JP2012-006440 20120116
- International Application: PCT/JP2012/081984 WO 20121210
- International Announcement: WO2013/108518 WO 20130725
- Main IPC: H01L35/02
- IPC: H01L35/02 ; H01L35/28 ; H01L35/10 ; H01L35/08 ; H01L35/32 ; H01L35/34

Abstract:
A thermoelectric element includes a p-type/n-type semiconductor element having an upper end surface and a lower end surface, a lower electrode that is joined to the lower end surface of the p-type/n-type semiconductor element to connect the p-type/n-type semiconductor element and another n-type/p-type semiconductor element adjacently thereto and has an area less than that of the lower end surface in a joint region therebetween. A joint portion is made of a solder and has a surface joint part joining the lower end surface of the p-type/n-type semiconductor element and a surface of the lower electrode while the lower end surface of the p-type/n-type semiconductor element and the surface of the lower electrode are opposed to each other A fillet part is formed to fill a space produced between intersecting surfaces, i.e., the lower end surface and a lateral side of the lower electrode, and composes a step part formed by the lower end surface and the lower electrode.
Public/Granted literature
- US20140345666A1 THERMOELECTRIC ELEMENT AND THERMOELECTRIC MODULE PROVIDED WITH SAME Public/Granted day:2014-11-27
Information query
IPC分类: