Discussed herein is an antenna system that comprises a feed element and a radiating element that are formed on a dielectric substrate positioned above a circuit board which includes a feed circuit and a ground layer. Specifically, the feed element is disposed within an outer periphery defined by the radiating element. A capacitive coupling is formed between the feed element and the radiating element. With the aforesaid configuration, the antenna system is less affected by the circuit board and interference from other elements that are mounted on the circuit board. Further, manufacturing costs are reduced as compared to the case where the feed element and the radiating element are respectively formed on a front and rear surface of a resin layer.