Invention Grant
- Patent Title: System for isolating power conductors using molded assemblies
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Application No.: US14970884Application Date: 2015-12-16
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Publication No.: US09917432B2Publication Date: 2018-03-13
- Inventor: David P. Serdynski , Dean T. Meyer
- Applicant: Rockwell Automation Technologies, Inc.
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Boyle Fredrickson, SC
- Main IPC: H02G5/00
- IPC: H02G5/00 ; H02G5/02 ; H02B1/14 ; H02B1/21

Abstract:
An improved electrical system may be provided by electrically isolating horizontal power distribution bus bars of differing phases, disposed along a preconfigured isolated bus support molding, from one another by covering each bus bar with an electrically insulating molded assembly. The electrically insulating molded assembly has contours configured to cover a particular bus bar (with respect to another bus bar or live fastener), arranged within the constraints of the preconfigured isolated bus support molding in the electrical system (such as along the back of the isolated bus support, between the isolated bus support and a wall of the electrical system).
Public/Granted literature
- US20170098929A1 System for Isolating Power Conductors Using Molded Assemblies Public/Granted day:2017-04-06
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