Invention Grant
- Patent Title: High-frequency module
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Application No.: US15016860Application Date: 2016-02-05
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Publication No.: US09917569B2Publication Date: 2018-03-13
- Inventor: Morio Takeuchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennet, LLP
- Priority: JP2013-163268 20130806
- Main IPC: H03H9/72
- IPC: H03H9/72 ; H03H9/64 ; H03H9/54 ; H03H7/38 ; H03H9/00 ; H03H9/60

Abstract:
A high frequency module includes a first external connection terminal, a second external connection terminal, a filter unit, a first matching circuit, and a second matching circuit. The filter unit is connected between the first external connection terminal and the second external connection terminal. The first matching circuit is connected between the first external connection terminal and the filter unit. The second matching circuit is connected between the second external connection terminal and the filter unit. The first matching circuit and the second matching circuit are inductively or capacitively coupled to each other.
Public/Granted literature
- US20160156335A1 HIGH-FREQUENCY MODULE Public/Granted day:2016-06-02
Information query
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