Invention Grant
- Patent Title: Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
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Application No.: US14329187Application Date: 2014-07-11
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Publication No.: US09918384B2Publication Date: 2018-03-13
- Inventor: Dirk M. Baars , Dale J. Doyle , Sankar J. Paul , Diana J. Williams , Carlos L. Barton
- Applicant: Rogers Corporation
- Applicant Address: US CT Rogers
- Assignee: ROGERS CORPORATION
- Current Assignee: ROGERS CORPORATION
- Current Assignee Address: US CT Rogers
- Agency: Cantor Colburn LLP
- Main IPC: B29C65/02
- IPC: B29C65/02 ; B29C65/48 ; B29C65/54 ; B32B37/12 ; B32B37/24 ; B32B38/18 ; B32B43/00 ; H05K1/11 ; B05D5/12 ; B32B27/04 ; B32B27/38 ; B32B37/00 ; B44C1/17 ; H05K1/00 ; H05K1/09 ; H05K3/38
Abstract:
A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
Public/Granted literature
- US20140318698A1 DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF Public/Granted day:2014-10-30
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