Invention Grant
- Patent Title: Circuit substrate, method of manufacturing circuit substrate, and electronic component
-
Application No.: US14133074Application Date: 2013-12-18
-
Publication No.: US09918388B2Publication Date: 2018-03-13
- Inventor: Hiroshi Asami
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2013-001853 20130109
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H05K3/10 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H05K1/11 ; H01L21/56 ; H05K3/34
Abstract:
A circuit substrate includes: a mounting region having an exposed surface that is planarized, and in which a predetermined chip is to be mounted; patterns provided in the mounting region, and including respective top faces that form a part of the exposed surface; and solder bumps provided on the respective patterns, and having substantially same shape as one another.
Public/Granted literature
- US20140191382A1 CIRCUIT SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC COMPONENT Public/Granted day:2014-07-10
Information query
IPC分类:
