Invention Grant
- Patent Title: Bendable structure and electronic device
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Application No.: US14978637Application Date: 2015-12-22
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Publication No.: US09918396B2Publication Date: 2018-03-13
- Inventor: Xiaoqin Han , Beiou Luan
- Applicant: Beijing Lenovo Software Ltd. , Lenovo (Beijing) Co., Ltd.
- Applicant Address: CN Beijing CN Beijing
- Assignee: Beijing Lenovo Software Ltd.,Lenovo (Beijing) Co., Ltd.
- Current Assignee: Beijing Lenovo Software Ltd.,Lenovo (Beijing) Co., Ltd.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201510501277 20150814
- Main IPC: H05K5/02
- IPC: H05K5/02 ; G06F1/16

Abstract:
The present application discloses a bendable structure for an electronic device, which includes a first structural layer and a second structural layer arranged to be overlapped with the first structural layer. The bendable structure has a straight state and a bent state, the first structural layer has a first bendable section which can be bent, and the second structural layer has a second bendable section which can be bent. The first bendable section corresponds to the second bendable section in an overlapped manner. When the bendable structure is in the bent state, a central angle corresponding to the first bendable section and a central angle corresponding to the second bendable section are same, such that both ends of the first bendable section are flush with corresponding ends of the second bendable section.
Public/Granted literature
- US20170048996A1 Bendable Structure and Electronic Device Public/Granted day:2017-02-16
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