Invention Grant
- Patent Title: Imaging device, inspection apparatus, and method of manufacturing electronic device
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Application No.: US14867736Application Date: 2015-09-28
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Publication No.: US09929205B2Publication Date: 2018-03-27
- Inventor: Takefumi Fukagawa , Takashi Miyata , Satoshi Higuchi , Tatsuya Okamoto
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-191445 20120831
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; G01J1/42 ; G01J1/04 ; G02B3/00

Abstract:
The imaging device includes a sensor substrate, a light-blocking substrate, a light-collecting substrate, a sealing material, and a light-transmitting member. The light-transmitting member includes a light-transmitting base disposed to be in contact with either the sensor substrate or the light-blocking substrate, and a light-transmitting resin which is filled between the base and the sensor substrate or the light-blocking substrate. A void is formed in at least a part of a space between the sealing material and the light-transmitting member.
Public/Granted literature
- US20160020245A1 IMAGING DEVICE, INSPECTION APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2016-01-21
Information query
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