Invention Grant
- Patent Title: Motorized adhesive dispensing module
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Application No.: US14526114Application Date: 2014-10-28
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Publication No.: US09931665B2Publication Date: 2018-04-03
- Inventor: Dason Cheung , Murad Kurwa , Raymundo Alatorre Mercado
- Applicant: Flextronics AP, LLC
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Haverstock & Owens LLP
- Main IPC: B05C17/01
- IPC: B05C17/01 ; B05C5/02 ; B05C11/10 ; B05C17/005

Abstract:
A liquid compound dispensing apparatus for dispensing a controlled amount of liquid compound onto a workpiece is described. The apparatus comprises a cartridge system. The cartridge system may accept a liquid compound cartridge containing liquid compound. The apparatus also comprises a plate, having a threaded bore, positioned above the cartridge system that is movable in a first and second direction, at least one plunger attached to the plate at a first end and attached to a piston at a second end. The piston is dimensioned to move within the liquid compound cartridge to displace liquid compound when the plate is moved in the second direction. A driving mechanism moves the plate in the first and the second directions to dispense product and comprises a motor, a threaded rod disposed through the threaded bore of the plate that is driven by a driving belt attached to the motor.
Public/Granted literature
- US20160114348A1 MOTORIZED ADHESIVE DISPENSING MODULE Public/Granted day:2016-04-28
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