Invention Grant
- Patent Title: Process for fabricating inductive heated solder cartridge
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Application No.: US14032616Application Date: 2013-09-20
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Publication No.: US09931705B2Publication Date: 2018-04-03
- Inventor: Mitsuhiko Miyazaki , Hisao Nemoto
- Applicant: Mitsuhiko Miyazaki , Hisao Nemoto
- Applicant Address: JP Osaka
- Assignee: Hakko Corp.
- Current Assignee: Hakko Corp.
- Current Assignee Address: JP Osaka
- Agent David B Abel
- Main IPC: B23K3/03
- IPC: B23K3/03 ; B23K3/047 ; F27D7/06
Abstract:
A method or process of fabricating a solder cartridge and solder cartridge made according to the process is disclosed. The solder cartridge made according to the process provides a self-temperature regulating solder tip for an inductive current soldering station having improved heater quality and stability with reduced manufacturing costs.
Public/Granted literature
- US20150083707A1 Process For Fabricating Inductive Heated Solder Cartridge Public/Granted day:2015-03-26
Information query
IPC分类:
