Invention Grant
- Patent Title: Wedge bonding tools, wedge bonding systems, and related methods
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Application No.: US15409172Application Date: 2017-01-18
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Publication No.: US09931709B2Publication Date: 2018-04-03
- Inventor: Dominick A. DeAngelis
- Applicant: ORTHODYNE ELECTRONICS CORPORATION
- Applicant Address: US DE Wilmington
- Assignee: Orthodyne Electronics Corporation
- Current Assignee: Orthodyne Electronics Corporation
- Current Assignee Address: US DE Wilmington
- Agent Christopher M. Spletzer, Sr.
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K20/10 ; H01L23/00 ; B23K20/00
Abstract:
A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
Public/Granted literature
- US20170209956A1 WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS Public/Granted day:2017-07-27
Information query
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