An assembly comprising: two ceramic bodies, which are joined by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced, in each case, from the ceramic bodies by at least 1 μm, and an average composition CK with a liquidus temperature Tl(CK), wherein the composition CK has a coefficient of thermal expansion α(CK), wherein α(CK)=m·α(K), wherein m≤1.5, especially m≤1.3 and preferably m≤1.2, wherein α(K) is the average coefficient of thermal expansion of the ceramic material of the ceramic bodies, wherein the joint has boundary layers, which border on the ceramic body, wherein at least one of the boundary layers, which lies outside of the core volume, has an average composition CB with a liquidus temperature Tl(CB), which lies not less than 50 K, preferably not less than 100 K, and especially preferably not less than 200 K, under the liquidus temperature Tl(CK) of the average composition CK of the core volume.