Invention Grant
- Patent Title: Polishing pad with foundation layer and polishing surface layer
-
Application No.: US14732497Application Date: 2015-06-05
-
Publication No.: US09931728B2Publication Date: 2018-04-03
- Inventor: William C. Allison , Diane Scott , Paul Andre Lefevre , James P. LaCasse , Alexander William Simpson
- Applicant: NexPlanar Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika S. Wilson
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24B37/26 ; B24B37/16 ; B24D11/00 ; B24D18/00 ; B24B37/20 ; B24B37/22
Abstract:
Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
Public/Granted literature
- US20150273655A1 POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER Public/Granted day:2015-10-01
Information query
