Invention Grant
- Patent Title: Thermoforming device, mold assembly, mold, and method
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Application No.: US15594172Application Date: 2017-05-12
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Publication No.: US09931782B2Publication Date: 2018-04-03
- Inventor: Erwin Wabnig , Thomas Halletz
- Applicant: KIEFEL GmbH
- Applicant Address: DE Freilassing
- Assignee: KIEFEL GMBH
- Current Assignee: KIEFEL GMBH
- Current Assignee Address: DE Freilassing
- Agency: Cantor Colburn LLP
- Priority: NL2017101 20160705; DE102016012487 20161020; EP16002415 20161114
- Main IPC: B29C51/04
- IPC: B29C51/04 ; B29C51/10 ; B29C51/26 ; B29C51/20 ; B29C51/38 ; B29K105/00

Abstract:
A thermoforming device is described. It relates to a mold assembly including a first and second mold, and to a mold that can be used in a thermoforming device. It also relates to a method for thermoforming a product. The thermoforming device is characterized in that the thermoforming device comprises a second pre-stretcher, in addition to a first pre-stretcher and a calibration element, and that the second pre-stretcher is at least partially and moveably arranged in a second mold body. A movement relative to the second mold body and towards the same forming cavity of the first pre-stretcher, the second pre-stretcher, and the calibration element, can be individually controlled, and the second pre-stretcher at least partially surrounds the first pre-stretcher and the calibration element.
Public/Granted literature
- US20180009154A1 THERMOFORMING DEVICE, MOLD ASSEMBLY, MOLD, AND METHOD Public/Granted day:2018-01-11
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