Invention Grant
- Patent Title: Semiaromatic polyamide, semiaromatic polyamide resin composition, and molded article
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Application No.: US14441954Application Date: 2013-11-12
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Publication No.: US09932444B2Publication Date: 2018-04-03
- Inventor: Isao Washio , Hiroki Ebata , Fumio Kageyama , Toshitaka Kosaka , Hideto Ogasawara , Akinori Amano , Nobuhiro Takizawa
- Applicant: MITSUI CHEMICALS, INC.
- Applicant Address: JP Minato-Ku, Tokyo
- Assignee: MITSUI CHEMICALS, INC.
- Current Assignee: MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Minato-Ku, Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2012-248592 20121112; JP2012-248596 20121112; JP2013-017052 20130131
- International Application: PCT/JP2013/006663 WO 20131112
- International Announcement: WO2014/073219 WO 20140515
- Main IPC: C08L77/06
- IPC: C08L77/06 ; C08G69/26 ; C08L33/14 ; C08L23/08 ; C08K3/16 ; C08K5/00 ; C08K7/14 ; C08G69/28 ; C08F255/00 ; C08L51/06

Abstract:
To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.
Public/Granted literature
- US20150329670A1 SEMIAROMATIC POLYAMIDE, SEMIAROMATIC POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE Public/Granted day:2015-11-19
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