Invention Grant
- Patent Title: Silicone composition and method for manufacturing heat-conductive silicone composition
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Application No.: US14914100Application Date: 2014-06-13
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Publication No.: US09932508B2Publication Date: 2018-04-03
- Inventor: Keita Kitazawa , Kunihiro Yamada
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-194880 20130920
- International Application: PCT/JP2014/003157 WO 20140613
- International Announcement: WO2015/040777 WO 20150326
- Main IPC: C08G77/08
- IPC: C08G77/08 ; C09K5/08 ; C08K3/08 ; C08K3/22 ; C08L83/04 ; C08L83/14 ; C09K5/14 ; C08G77/12 ; C08G77/20

Abstract:
A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G″ of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G′ after 3,000 seconds from the start of holding is 10,000 Pa or less, G′ after 7,200 seconds from the start of holding is 100,000 Pa or less, and G′ exceeds G″ after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.
Public/Granted literature
- US09969919B2 Silicone composition and method for manufacturing heat-conductive silicone composition Public/Granted day:2018-05-15
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