Fluid-assisted thermal management of evaporation sources

Invention Grant

US09932666B2 Fluid-assisted thermal management of evaporation sources 有权

Patent Title: Fluid-assisted thermal management of evaporation sources
Application No.: US15082290

Application Date: 2016-03-28
Publication No.: US09932666B2

Publication Date: 2018-04-03
Inventor: Markus Eberhard Beck , Ulrich Alexander Bonne , Robert G. Wendt
Applicant: Siva Power, Inc.
Applicant Address: US CA San Jose
Assignee: SIVA POWER, INC.
Current Assignee: SIVA POWER, INC.
Current Assignee Address: US CA San Jose
Agency: Morgan, Lewis & Bockius LLP
Main IPC: H01L21/00
IPC: H01L21/00 ; C23C14/26 ; H01L31/046 ; C23C16/448 ; F25B39/00 ; H01L31/032 ; H01L31/18 ; H01L51/00 ; H01L51/56 ; C23C16/02 ; C23C16/28 ; C23C16/52 ; C23C14/24 ; C23C14/54 ; F25D17/02 ; F25B39/02 ; H01L21/02

Abstract:

In various embodiments, evaporation sources for deposition systems are heated and/or cooled via a fluid-based thermal management system.

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备