Invention Grant
- Patent Title: Non-continuous bonding of sputtering target to backing material
-
Application No.: US13699311Application Date: 2011-05-23
-
Publication No.: US09932667B2Publication Date: 2018-04-03
- Inventor: Jong-Won Shin , Nikolaus Margadant , Klaus Leitner
- Applicant: Jong-Won Shin , Nikolaus Margadant , Klaus Leitner
- Applicant Address: CN Qingyuan, Guangdong Province
- Assignee: VITAL THIN FILM MATERIALS (GUANGDONG) CO., LTD.
- Current Assignee: VITAL THIN FILM MATERIALS (GUANGDONG) CO., LTD.
- Current Assignee Address: CN Qingyuan, Guangdong Province
- Agency: Smith, Gambrell & Russell, LLP
- Priority: EP10005319 20100521
- International Application: PCT/EP2011/058335 WO 20110523
- International Announcement: WO2011/144759 WO 20111124
- Main IPC: C23C14/34
- IPC: C23C14/34

Abstract:
A target assembly comprising—a support body having a carrying surface; —a sputtering target having an attaching surface, said carrying surface and said attaching surface being arranged in opposing facing relation to one another, thereby defining an intermediate space between said carrying surface and said attaching surface; and—a bonding material disposed in the intermediate space for binding said attaching surface to said carrying surface, —wherein distinct areas of one or both of said attaching surface and said carrying surface are selectively, superficially treated to enhance the bonding strength of said bonding material in said distinct areas.
Public/Granted literature
- US20130118898A1 NON-CONTINUOUS BONDING OF SPUTTERING TARGET TO BACKING MATERIAL Public/Granted day:2013-05-16
Information query
IPC分类: