Invention Grant
- Patent Title: Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
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Application No.: US15220472Application Date: 2016-07-27
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Publication No.: US09932684B2Publication Date: 2018-04-03
- Inventor: Matthew Thorseth , Zuhra Niazimbetova , Yi Qin , Julia Woertink , Joanna Dziewiszek , Erik Reddington , Mark Lefebvre
- Applicant: Rohm and Haas Electronic Materials LLC , Dow Global Technologies LLC
- Applicant Address: US MA Marlborough US MI Midland
- Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee Address: US MA Marlborough US MI Midland
- Agent John J. Piskorski
- Main IPC: C25D3/38
- IPC: C25D3/38 ; H01L23/00 ; H05K3/06 ; H05K1/11 ; H05K3/40 ; C25D7/12 ; C25D5/02 ; C25D7/00
Abstract:
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Public/Granted literature
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