Invention Grant
- Patent Title: Method and system for assessing the quality of adhesively bonded joints using ultrasonic waves
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Application No.: US13862937Application Date: 2013-04-15
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Publication No.: US09933397B2Publication Date: 2018-04-03
- Inventor: Roman Grigorievich Maev , Sergey Aleksandrovich Titov , Alexey Nikolaevich Bogachenkov
- Applicant: Tessonics Corp.
- Applicant Address: US MI Birmingham
- Assignee: Tessonics Corp.
- Current Assignee: Tessonics Corp.
- Current Assignee Address: US MI Birmingham
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: G01B5/28
- IPC: G01B5/28 ; G01N3/32 ; G01N29/04 ; G01N29/44 ; G01N29/30

Abstract:
A method is provided for assessment of quality of an adhesively-bonded lap joint, wherein the joint includes a first metal plate, a second metal plate and an adhesive therebetween. The method includes sending ultrasonic waves normally to the surface of a sample outside of the joint where the sample has a first sample metal plate with the same properties as does the first metal plate at an assessment point of the joint. Reflected waves from the sample joint as a reference waveform are recorded. Wideband ultrasonic waves are sent normally to the surface of the joint at the assessment point. Reflected waves of the ultrasonic waves from the joint are recorded. A waveform of the reflected waves from the joint and reference waveform are analyzed to determine an informative parameter. The informative parameter is compared with a threshold value to assess quality of the joint.
Public/Granted literature
- US20130289895A1 METHOD AND SYSTEM FOR ASSESSING THE QUALITY OF ADHESIVELY BONDED JOINTS USING ULTRASONIC WAVES Public/Granted day:2013-10-31
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