Invention Grant
- Patent Title: Mask blank, phase-shift mask and method for manufacturing semiconductor device
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Application No.: US15121124Application Date: 2014-12-09
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Publication No.: US09933698B2Publication Date: 2018-04-03
- Inventor: Atsushi Matsumoto , Hiroaki Shishido , Takashi Uchida
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-055099 20140318
- International Application: PCT/JP2014/082500 WO 20141209
- International Announcement: WO2015/141078 WO 20150924
- Main IPC: G03F1/26
- IPC: G03F1/26 ; G03F1/32 ; G03F1/58 ; G03F7/20

Abstract:
To provide a phase-shift mask in which the reduction in thickness of a light-shielding film is provided when a transition metal silicide-based material is used for the light-shielding film and by which the problem of ArF light fastness can be solved; and a mask blank for manufacturing the phase-shift mask.A mask blank 10 comprises a phase-shift film 2 and a light-shielding film 4 on a transparent substrate 1, the phase-shift film 2 is made of a material with ArF light fastness, and at least one layer in the light-shielding film 4 is made of a material which contains transition metal, silicon, and nitrogen, and satisfies the conditions of Formula (1) below: CN≤9.0×10−6×RM4−1.65×10−4×RM3−7.718×10−2×RM2+3.611×RM−21.084 Formula (1) wherein RM is a ratio of the content of transition metal to the total content of transition metal and silicon in said one layer, and CN is the content of nitrogen in said one layer.
Public/Granted literature
- US20160377975A1 MASK BLANK, PHASE-SHIFT MASK AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-12-29
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