Invention Grant
- Patent Title: Plasma processing apparatus and waveform correction method
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Application No.: US15626502Application Date: 2017-06-19
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Publication No.: US09934947B2Publication Date: 2018-04-03
- Inventor: Shinji Kubota
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2016-121596 20160620
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A plasma processing apparatus includes an electrode to which a high frequency for plasma generation is applied and which serves as a mounting table for a target object. The plasma processing apparatus further includes a high frequency generation unit, a distortion component extraction unit and a waveform correction unit. The high frequency generation unit generates the high frequency by using waveform data including a set frequency component having a predetermined frequency. The distortion component extraction unit extracts a distortion component given to the high frequency in a path for transmitting the high frequency generated by the high frequency generation unit to the electrode. The waveform correction unit corrects the waveform data by combining an antiphase component obtained by inverting a phase of the distortion component and the set frequency component of the waveform data used for generation of the high frequency.
Public/Granted literature
- US20170365445A1 PLASMA PROCESSING APPARATUS AND WAVEFORM CORRECTION METHOD Public/Granted day:2017-12-21
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