This process includes steps: a) providing a carrier substrate including a receiving face; b) depositing a nonstick coating on the receiving face, the nonstick coating including a central region and a peripheral region; and c) trimming the carrier substrate so as to remove the peripheral region of the nonstick coating and to form a recess on the periphery of the carrier substrate, in order to obtain the handle wafer. Also relates to a process for temporarily bonding a substrate to a handle wafer fabricated using the process described above. Furthermore relates to a handle wafer fabricated using the process described above.