Invention Grant
- Patent Title: Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method
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Application No.: US15232175Application Date: 2016-08-09
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Publication No.: US09934996B2Publication Date: 2018-04-03
- Inventor: Michihiro Sugo , Hiroyuki Yasuda , Shohei Tagami , Masahito Tanabe
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2015-160812 20150818
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C09J183/00 ; B32B7/12 ; B32B27/06 ; H01L21/304 ; H05F1/00
Abstract:
A bonding arrangement comprising a silicone-base adhesive composition is suited for temporarily bonding a wafer to a support for wafer processing. The bonding arrangement includes a first temporary bond layer of non-silicone thermoplastic resin, and a second temporary bond layer of thermosetting silicone polymer and/or a third temporary bond layer of thermosetting siloxane-modified polymer. The second and/or third bond layer contains an antistatic agent.
Public/Granted literature
- US20170053821A1 WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFER MANUFACTURING METHOD Public/Granted day:2017-02-23
Information query
IPC分类:
