Invention Grant
- Patent Title: Adhesive sheet and method of manufacturing electronic component
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Application No.: US15326195Application Date: 2015-07-06
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Publication No.: US09934997B2Publication Date: 2018-04-03
- Inventor: Tomoya Tsukui , Gosuke Nakajima
- Applicant: Denka Company Limited
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: JP2014-144531 20140714
- International Application: PCT/JP2015/069446 WO 20150706
- International Announcement: WO2016/009879 WO 20160121
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683 ; C09J4/06 ; C09J7/02 ; C09J133/10 ; C09J5/06 ; H01L21/78

Abstract:
An adhesive sheet is provided that is capable of inhibiting scraping up of an adhesive in the dicing step, does not cause chip detachment during dicing processing, facilitates picking up, and does not readily develop adhesive transfer. According to the present invention, an adhesive sheet is provided that comprises a substrate film and an adhesive layer laminated on the film, wherein the adhesive layer contains 100 parts by mass of a (meth)acrylate copolymer, from 5 to 250 parts by mass of a photopolymerizable compound, from 20 to 160 parts by mass of a softener, from 0.1 to 30 parts by mass of a curing agent, and from 0.1 to 20 parts by mass of a photopolymerization initiator, and the photopolymerizable compound has a weight average molecular weight from 40,000 to 220,000.
Public/Granted literature
- US20170200629A1 ADHESIVE SHEET AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2017-07-13
Information query
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