- Patent Title: Method of evaluating metal contamination in boron-doped P-type silicon wafer, device of evaluating metal contamination in boron-doped P-type silicon wafer, and method of manufacturing boron-doped P-type silicon wafer
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Application No.: US14837515Application Date: 2015-08-27
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Publication No.: US09935020B2Publication Date: 2018-04-03
- Inventor: Shinya Fukushima , Tsuyoshi Kubota
- Applicant: SUMCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SUMCO CORPORATION
- Current Assignee: SUMCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-185513 20140911
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L29/167 ; G01R31/265 ; H01L21/67
Abstract:
An aspect of the present invention relates to a method of evaluating metal contamination in a boron-doped p-type silicon wafer, which comprises measuring over time by a microwave photoconductive decay method a recombination lifetime following irradiation with light of a silicon wafer being evaluated and obtaining information on change over time of the recombination lifetime, and comparing the information on change over time of the recombination lifetime that has been obtained with reference information on change over time that has been obtained by calculation or actual measurement of a recombination lifetime of an Fe-contaminated boron-doped p-type silicon wafer to determine whether or not metal contamination other than Fe is present in the silicon wafer being evaluated.
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