Invention Grant
- Patent Title: Method and apparatus for printing integrated circuit bond connections
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Application No.: US14142823Application Date: 2013-12-28
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Publication No.: US09935028B2Publication Date: 2018-04-03
- Inventor: Erick Merle Spory
- Applicant: Global Circuit Innovations Incorporated
- Applicant Address: US CO Colorado Springs
- Assignee: Global Circuit Innovations Incorporated
- Current Assignee: Global Circuit Innovations Incorporated
- Current Assignee Address: US CO Colorado Springs
- Agent Thomas J. Lavan
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/20 ; H01L23/00 ; H01L23/26 ; H01L21/50 ; H01L21/48 ; H01L23/04 ; H01L23/495 ; H01L23/498 ; H01L23/10
Abstract:
A method for assembling a packaged integrated circuit is provided. The method includes placing a die into a cavity of a package base, securing the die to the package base with a die attach adhesive, printing a bond connection between a die pad of the die and a lead of the package base or a downbond, and sealing a package lid to the package base.
Public/Granted literature
- US20140252584A1 Method and apparatus for printing integrated circuit bond connections Public/Granted day:2014-09-11
Information query
IPC分类:
