Invention Grant
- Patent Title: Resin interposer, semiconductor device using resin interposer, and method of producing resin interposer
-
Application No.: US15618939Application Date: 2017-06-09
-
Publication No.: US09935061B2Publication Date: 2018-04-03
- Inventor: Shinya Sasaki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-123689 20160622
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/498 ; H01L21/48
Abstract:
A resin interposer having a semiconductor chip mounted thereon to couple the semiconductor chip to a printed circuit board, the resin interposer includes a wiring layer having a front surface to which the semiconductor chip is coupled and formed by alternately laminating an insulating resin and a metal wiring, and a pressure-sensitive adhesive layer formed on a rear surface of the wiring layer and having a through via formed therein to couple the wiring layer and the printed circuit board to each other.
Public/Granted literature
- US20170373020A1 RESIN INTERPOSER, SEMICONDUCTOR DEVICE USING RESIN INTERPOSER, AND METHOD OF PRODUCING RESIN INTERPOSER Public/Granted day:2017-12-28
Information query
IPC分类:
