Invention Grant
- Patent Title: Methods of forming connector pad structures, interconnect structures, and structures thereof
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Application No.: US15431514Application Date: 2017-02-13
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Publication No.: US09935067B2Publication Date: 2018-04-03
- Inventor: Chia-Lun Chang , Chung-Shi Liu , Hsiu-Jen Lin , Hsien-Wei Chen , Ming-Da Cheng , Wei-Yu Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company LTD.
- Current Assignee: Taiwan Semiconductor Manufacturing Company LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/538 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/29 ; H01L23/498 ; H01L21/56 ; H01L21/683 ; H01L25/065 ; H01L25/10
Abstract:
Methods of forming connector pad structures, interconnect structures, and structures thereof are disclosed. In some embodiments, a method of forming a connector pad structure includes forming an underball metallization (UBM) pad, and increasing a surface roughness of the UBM pad by exposing the UBM pad to a plasma treatment. A polymer material is formed over a first portion of the UBM pad, leaving a second portion of the UBM pad exposed.
Public/Granted literature
- US20170154862A1 Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof Public/Granted day:2017-06-01
Information query
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