Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15392693Application Date: 2016-12-28
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Publication No.: US09935103B2Publication Date: 2018-04-03
- Inventor: Che-Cheng Chang , Chih-Han Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/088 ; H01L29/423 ; H01L29/66 ; H01L21/8234 ; H01L21/3105 ; H01L21/02 ; H01L21/3213 ; H01L29/06 ; H01L29/49 ; H01L29/51 ; H01L21/8238 ; H01L27/092

Abstract:
A semiconductor device includes first and second Fin FET and a separation plug made of an insulating material and disposed between the first and second Fin FETs. The first Fin FET includes a first fin structure extending in a first direction, a first gate dielectric formed over the first fin structure and a first gate electrode formed over the first gate dielectric and extending a second direction perpendicular to the first direction. The second Fin FET includes a second fin structure, a second gate dielectric formed over the second fin structure and a second gate electrode formed over the first gate dielectric and extending the second direction. In a cross section a maximum width of the separation plug is located at a height Hb, which is less than ¾ of a height Ha of the separation plug.
Public/Granted literature
- US20170110454A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-04-20
Information query
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