Invention Grant
- Patent Title: Light emitting diode panel and manufacturing method thereof
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Application No.: US15480864Application Date: 2017-04-06
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Publication No.: US09935153B1Publication Date: 2018-04-03
- Inventor: Jong-hoon Jung , Dae-sik Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0147756 20161107
- Main IPC: H01L33/36
- IPC: H01L33/36 ; H01L27/15 ; H01L33/62 ; H01L33/50 ; H01L33/48 ; G02B5/20 ; H01L27/32

Abstract:
A light emitting diode (LED) panel and a manufacturing method thereof are provided. The LED panel includes: a substrate; and a plurality of subpixel areas formed over a substrate, in which each of the plurality of subpixel areas include: a plurality of pixel electrodes spaced from each other; at least LED formed over the plurality of pixel electrodes; and at least one transistor disposed at one side of at least one of the plurality of pixel electrodes to control at least one of the plurality of pixel electrodes.
Information query
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