Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15188233Application Date: 2016-06-21
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Publication No.: US09935169B2Publication Date: 2018-04-03
- Inventor: Takeyoshi Nishimura
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JP2015-159138 20150811
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L29/10 ; H01L29/739 ; H01L23/34 ; H01L25/18

Abstract:
A semiconductor device includes a drift layer of a first conductivity-type, having a super junction structure, including a plurality of columns of a second conductivity-type, a plane pattern of each of the columns extends along a parallel direction to the principal surface of the layer, the columns are arranged at regular intervals; a plurality of well regions of the second conductivity-type provided in a surface-side layer of the layer of the first conductivity-type; a plurality of source regions of the first conductivity-type selectively provided in the plurality of well regions; a gate insulating film provided on the principal surface; an array of gate electrodes disposed on the gate insulating film, each of the gate electrodes is provided so as to bridge the corresponding source regions in a pair of neighboring two well regions; and a temperature detection diode provided at a partial area defined in the array of the gate electrodes.
Public/Granted literature
- US20170047321A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-02-16
Information query
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